TOK is also supplying resists for BEOL applications, plating and TSV related processes.
We have put in the market positive thick plating resists, TMAH developable.
TOK is designing for many years now thick application material, mainly for MEMS structuring, bonding and passivation.
TOK is developing photosensitive adhesive materials, able to do permanent bonding and creating cavities at the interface of the 2 bonded substrates.
TOK has designed a complete Temporary bonding system, including Bonding, Debonding, Glass rework tools + Adhesive and Cleaning materials.
TOK is supplying as well a variety of strippers for many different type of processes.
If your standard HMDS adhesion pre-teatment is showing limitation or if you are suffering from substrate poisoning affecting your pattern profiles, CAUT200 could help you.
Shrink Assist Film for Enhanced Resolution.
If you would like to decrease your CD target without investing in new lithography tool.
You have here only a very short summary of what TOK portfolio is.
So if you have a specific demand, don't hesitate to contact us directly and we will come back to you as soon as possible.