Products
g-line & i-line
TOK is developing for more than 30 years g-line and i-line resists for many types of processes.
You will have some examples here:
KrF, ArF and ArF immersion
For more advanced nodes, TOK is developing DUV resists.
You will have some examples here: Under preparation
BEOL, Plating and TSV
TOK is also supplying resists for BEOL applications, plating and TSV related processes.
We have put in the market positive thick plating resists, TMAH developable.
You will have some examples here: Under preparation
MEMS Structures
TOK is designing for many years now thick application material, mainly for MEMS structuring, bonding and passivation.
You will find here a direct link to TMMR (liquid type) / TMMF (film type) description: Under preparation
You want to know more about those innovative products ---> Click HERE
Permanent Bonding
TOK is developing photosensitive adhesive materials, able to do permanent bonding and creating cavities at the interface of the 2 bonded substrates.
You will find more details here: View Online Doc
Temporary Bonding
TOK has designed a complete Temporary bonding system, including Bonding, Debonding, Glass rework tools + Adhesive and Cleaning materials.
You will find more details here: Under preparation
Clean solutions and strippers
TOK is supplying as well a variety of strippers for many different type of processes.
You will find more details here: Under preparation
Adhesive Enhanced material
If your standard HMDS adhesion pre-teatment is showing limitation or if you are suffering from substrate poisoning affecting your pattern profiles, CAUT200 could help you.
You will find more details here: Under preparation
SHRINK ASSIST MATERIALS
Shrink Assist Film for Enhanced Resolution.
If you would like to decrease your CD target without investing in new lithography tool.
You will find more details here: Under preparation
You have here only a very short summary of what TOK portfolio is.
So if you have a specific demand, don't hesitate to contact us directly and we will come back to you as soon as possible.